LM4766T DATASHEET PDF
LMT/NOPB Texas Instruments Audio Amplifiers Overture Audio Pwr Amp Series Dual 40W datasheet, inventory, & pricing. LMT Texas Instruments Audio Amplifiers datasheet, inventory, & pricing. LMT LM – Overture Audio Power Amplifier Series Dual Watt Audio Power Amplifier With Mute, Package: to , Pin Nb=15 LM OvertureTM.
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Equation 1 exemplifies the theoretical maximum power dis. Refer to the graphs of Power Dissipation versus. Numbers in parentheses represent pinout for amplifier B.
Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink Section. Special Audio Amplifier Application Circuit 5 www. The LM contains over-voltage protection circuitry that.
Taking into account supply line fluc. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Thus by knowing the total supply voltage and rated output load, the maximum power dissipation dataasheet can be calcu- lated.
The LM is a stereo audio amplifier capable of delivering.
The choice of a heat sink for a high-power audio amplifier is. Using the best heat sink possible within the cost and. Thus by knowing the total supply voltage and rated output. Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen such that thermal shutdown will not be reached during normal opera- tion. Taking into account supply line fluc- tuations, it is a good idea to pull out 1 mA per mute pin or 2 mA total if both pins are tied together.
The LM has excellent power supply rejection and does. The LM has a sophisticated thermal protection scheme. Equation 1 exemplifies the theoretical maximum power dis- sipation point of each amplifier where V CC is the total supply voltage.
LMT Datasheet(PDF) – National Semiconductor (TI)
The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes. The waveform to the right of the SOA graph exemplifies how the dynamic pro- tection will cause waveform distortion when enabled.
Power dissipation within the integrated circuit package is a. Upon turn-off, the output of the LM is brought to ground be- fore the power supplies such that no transients occur at power-down.
This greatly reduces the stress imposed on the IC by. Single Supply Application Circuit. Refer to the graphs of Power Dissipation versus Output Power in the Typical Performance Characteristics section which show the actual full range of power dissipation datasheeet just the maximum theoretical point that results from Equation 1.
Since convection heat flow power dissipation is analogous to current flow, thermal resistance is analogous to electrical resistance, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM is equal to the following: Operating graph in the Typical Performance Characteris.
Special Audio Amplifier Application Circuit. This calculation dafasheet made using Equation 3. SPiKe Protection Circuitry is not enabled.
It starts operating again when the die temperature. The LM is protected from instantaneous peak. The package dissipation is twice the number which re. Datqsheet system power-up, the under-voltage protection cir.
Single Supply Amplifier Application Circuit. Once the maximum package power dissipation has been. SPiKe Protection means that these. However, to improve system performance as well as eliminate possible oscillations, the LM should have its supply leads bypassed with low-inductance capacitors having short leads that are lo- cated close to the package terminals.
Please refer to AN for more detailed information. Since the die temperature is directly dependent upon the. SPiKe Protection means that these parts are safeguarded at the output against overvoltage, un- dervoltage, overloads, including thermal runaway and in- stantaneous temperature peaks.